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Home > PCB Prototypes > Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board | DK3.0 | DF 0.001 Microwave PCB
Rogers RO3003 High Frequency PCB 2-Layer Rogers 3003 10mil Circuit Board | DK3.0 | DF 0.001 Microwave PCB

(Note: Printed Circuit Boards are custom-made products; images and parameters are for reference only.)


Introduction to RO3003 High Frequency PCBs

Rogers RO3003 high frequency circuit materials consist of ceramic-filled PTFE composites, specifically designed for commercial microwave and RF applications. These materials provide exceptional electrical performance and mechanical stability at competitive prices, ensuring consistent mechanical properties. Designers can develop multi-layer board configurations without facing issues like warpage or reliability concerns.


The RO3003 materials feature a coefficient of thermal expansion (CTE) of 17 ppm/℃ in both the X and Y axes, closely matching that of copper. This compatibility results in excellent dimensional stability, with typical etch shrinkage after processing being less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, ensuring outstanding reliability for plated through-holes, even in challenging environments.


Typical Applications

  1. 1.Automotive radar systems
  2. 2.Cellular telecommunications networks
  3. 3.Datalink over cable systems
  4. 4.Direct broadcast satellite technology
  5. 5.Global Positioning System (GPS) antennas
  6. 6.Patch antennas for wireless communication
  7. 7.Power amplifiers and antennas
  8. 8.Power backplanes
  9. 9.Remote meter reading devices


PCB Specifications

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Rogers RO3003 10mil 0.254mm High Frequency PCB DK3.0 RF PCB for Automotive Radar Applications

PCB SIZE

100 x 100mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

NO

Through Hole Components

NO

LAYER STACKUP

copper ------- 35 um(1 oz)

RO3003 0.254mm

copper ------- 35 um(1 oz)

TECHNOLOGY

 

Minimum Trace and Space:

5mil / 5mil

Minimum / Maximum Holes:

0.3mm / 0.8mm

Number of Different Holes:

N/A

Number of Drill Holes:

N/A

Number of Milled Slots:

N/A

Number of Internal Cutouts:

N/A

Impedance Control:

N/A

Number of Gold finger:

N/A

BOARD MATERIAL

 

Glass Epoxy:

RO3003 0.254mm

Final foil external:

1oz

Final foil internal:

N/A

Final height of PCB:

0.3 mm ±0.1

PLATING AND COATING

 

Surface Finish

N/A

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

N/A

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

N/A

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

The RO3003 high frequency PCBs come in double-sided, multi-layer, and hybrid constructions, with copper weights ranging from 0.5oz to 2oz and thicknesses from 0.3mm to 1.6mm. The maximum size available is 400mm x 500mm, with surface finishes including bare copper, hot air leveling, and immersion gold.



Data Sheet for Rogers 3003 (RO3003)

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 RO3003 Typical Value

Property

RO3003

Direction

Units

Condition

Test Method

Electrical Properties

 

 

 

 

 

Dielectric Constant,εProcess

3.0±0.04

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

3

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.001

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-3

Z

ppm/℃

10 GHz -50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

107

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

107

 

MΩ

COND A

IPC 2.5.17.1

Thermal Properties

 

 

 

 

 

Td

500

 

℃ TGA

 

ASTM D 3850

Coefficient of Thermal Expansion
(-55 to 288℃)

17
16
25

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.4.1

Thermal Conductivity

0.5

 

W/M/K

50℃

ASTM D 5470

Mechanical Properties

 

 

 

 

 

Copper Peel Stength

12.7

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Young's Modulus

930
823

X
Y

MPa

23℃

ASTM D 638

Dimensional Stability

-0.06
0.07

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Physical Properties

 

 

 

 

 

Flammability

V-0

 

 

 

UL 94

Moisture Absorption

0.04

 

%

D48/50

IPC-TM-650 2.6.2.1

Density

2.1

 

gm/cm3

23℃

ASTM D 792

Specific Heat

0.9

 

j/g/k

 

Calculated

Lead-free Process Compatible

Yes

 

 

 



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